METHOD AND DEVICE FOR SOLDERING ELECTRONIC PART

摘要

PROBLEM TO BE SOLVED: To surely and easily joint a connection pad regardless of floating of a solder ball connection terminal 12. SOLUTION: A first process where a solder paste 15 is stuck to the solder ball connection terminal 12 of a surface-mounting part 11, a second process where the surface-mounting part 11 is mounted on a substrate 13 and the solder paste 15 sticking to the solder ball connection terminal 12 is made to be adhered to a connection pad 14 of the substrate 13, and a third process where the solder paste 15 stuck between the solder ball connection terminal 12 and the connection pad 14 is melted at a high temperature so that they are connected together, allowing them to be jointed together, are provided.