| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device and its manufacturing method for forming a micro-electrode with a size smaller than a limiting dimension of precision in the exposing unit, and a minute wiring at the same time. SOLUTION: An electrode region includes a vertically extending electrode region 4 in contact with an edge face of a lower-layer side wall 3 in an elongated direction, and a wiring region 5 in a body. The wiring region 5 is put in contact with an upper edge of the electrode region 4 and extended partly in a horizontal direction and crossed with the lower-layer side wall 3 in the elongated direction.
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