| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder sucking device wherein peeling of a land is suppressed while work is easy. SOLUTION: A solder sucking device 6 is held with a holder member 14 so that the sucking direction for a solder with the solder sucking device 6 is vertical to a land on the mounting surface of a printed wiring board 1. The holder member 14 is translated relative to the mounting surface by a translation mechanism 30. Thus, the solder sucking device 6 is moved over the entire region of the board 1 while the sucking direction for a solder by a sucking-in opening 26 is kept vertical to the land at all times, for efficient and easy work for removing a solder while peeling of the land is suppressed to protect the board.
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