发明名称 MANUFACTURING METHOD OF ELECTRONIC COMPONENT AND DEVICE THEREOF
摘要 PROBLEM TO BE SOLVED: To provide the manufacturing method of an electronic component, which makes possible the stabilization of the bending positions of leads and the prevention of the generation of clevises, and the manufacturing device of the component. SOLUTION: The manufacturing method of an electronic component, which is provided with a resin molded part 2 provided with a built-in electronic element and leads 3 projected from the part 2, has at least a first process that V-shaped grooves are respectively formed in the vicinities of the roots of the leads 3 and a second process that the point parts of the leads 3 are pressed and at the same time, the leads 3 in the vicinities of the V-shaped grooves are bent downwards.
申请公布号 JP2001168258(A) 申请公布日期 2001.06.22
申请号 JP19990345985 申请日期 1999.12.06
申请人 SEIKO EPSON CORP 发明人 SATO KEIICHI;KANBE EIJI;URUSHIDO HIDEOMI
分类号 B21D5/01;B21F1/00;H01L23/50;H03H3/02;(IPC1-7):H01L23/50 主分类号 B21D5/01
代理机构 代理人
主权项
地址