| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide the connection structure of a conductor for appropriately suppressing the deposition of a foreign object. SOLUTION: Since diffusion absorption layers 50 and 52, where silver that is the component of wiring 32 and 34 is diffused, are overlapped to an area near the overlapping portion of the wiring 32 and 33 and electrodes 38 and 40, silver is directed also toward the inside of the diffusion absorption layers 50 and 52, when the silver is diffused from the surface of the wiring 32 and 34 to the outside. As a result, since the ratio for diffusing the silver into the electrodes 38 and 40 is reduced, diffusion of silver in the electrodes 38 and 40 is suppressed and then the deposition of foreign objects are suppressed.</p> |
