First and second pressure sensors (132, 134) of different detection ranges detect the pressure in a process chamber (102) of an etching device (100). A pressure controller (144) selects optimum pressure data for the pressure of the process chamber (102) from the pressure data provided by the first and second pressure sensors (132, 134). The selected pressure data is analyzed with a resolution selected according to the pressure in the processing room (102) to determine the pressure data of predetermined data density. The pressure controller (144) controls a pressure control valve (130) so that the pressure data may follow predetermined pressure data.
申请公布号
WO0145150(A1)
申请公布日期
2001.06.21
申请号
WO2000JP08852
申请日期
2000.12.14
申请人
TOKYO ELECTRON LIMITED;HIROSE, EIJI;IWABUCHI, NORIYUKI;YOKOUCHI, TAKESHI;SUZUKI, SHINGO