TRANSPORT ARM STRUCTURE AND WAFER TRANSPORTING METHOD

摘要

PROBLEM TO BE SOLVED: To obtain a transport structure and wafer transporting method which can be applied to a device required to transport a high-temperature wafer in a semiconductor manufacturing apparatus. SOLUTION: The structure includes a fan-shaped transport blade 2 continuous to a predetermined position of a transport arm 1 to be openable in a fan manner. In a normal transportation mode, the plate 2 is used without spreading and in a transportation mode of a wafer 3 at least at a predetermined high temperature, the blade 2 is spread.