发明名称 Gehäuseanordnung für eine bauteilbestückte Leiterplatte
摘要 A housing configuration for a printed circuit board equipped with components, includes a housing with at least partially metallic housing walls as well as at least one metallic spring profile element. The spring profile element has a first and a second profile leg, which are connected to one another forming an essentially V-shaped profile cross section, and is inserted into a gap region between an edge of the printed circuit board and the housing wall. The first profile leg is connected to a ground terminal of the printed circuit board, and the second profile leg exerts an elastic spreading force as it bears against the housing wall and makes electrical contact with the latter.
申请公布号 DE19804590(C2) 申请公布日期 2001.06.21
申请号 DE1998104590 申请日期 1998.02.05
申请人 SIEMENS AG 发明人 BAGUNG, DETLEV;LUDWIG, GUNTER
分类号 H05K9/00;(IPC1-7):H05K9/00;H05K5/04 主分类号 H05K9/00
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