The invention provides for the formation of thin devices having an overall thickness (TD) which is less than the width (WSF) of the sealing frame used to mount the cap (260). The formation of thin devices is facilitated by the use of spacers (270) in the device region (208) to support the cap.
申请公布号
WO0144866(A1)
申请公布日期
2001.06.21
申请号
WO1999SG00146
申请日期
1999.12.17
申请人
INFINEON TECHNOLOGIES ASIA PACIFIC PTE. LTD.;GUENTHER, EWALD, KARL, MICHAEL
