Apparatus and method for solder bump inspection

摘要

A bump inspection apparatus for inspecting shapes of a plurality of bumps each having a planar top portion, on an inspection object, comprising an illumination optical system for illuminating the top portions with a vertical parallel pencil of light through a telecentric optical system, an observation optical system using a telecentric optical system having an optical axis thereof in conformity with that of the illumination optical system, an observation portion for observing the images of the top portions through the observation optical system in a predetermined range of the inspection object, and a processing portion for analyzing the shapes of the bumps on the basis of the images of the top portions by the observation portion, wherein the processing portion includes analyzing means for analyzing the areas of the planar top portions for the individual bumps and judging means for judging whether or not the rears of the top portions are within a predetermined range. A bump inspection method using this apparatus is described, too.