METHOD FOR CUTTING SURFACE PLATE OF LAPPING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a method for facing a surface plate that is suitable to yield a lapped workpiece with good dimensional accuracy even if the material of a lapping surface plate is a resin with a high thermal expansion. SOLUTION: A method for cutting a surface plate of a lapping device tool- cuts and flats the surface of a lapping surface plate of a lapping device for polishing the surface of a substrate by pressing the substrate held by a chuck mechanism against the lapping surface plate rotated and giving sliding motion to the substrate and lapping surface! plate. The surface cutting with the tool is carried out while a thin film of water is formed on the surface of the lapping surface plate.