Electronics package having a ball grid array which is electrically accessible

摘要

An electronic assembly comprising an electrical device, an array of solder balls connected to the electrical device, and a sheet adjacent the electrical device. The sheet has a plurality of holes formed therethrough and a plurality of electrical lines formed thereon. Each electrical line has a first contact portion on a first surface of the sheet, a probe contact at a location away from the electrical device, and a trace interconnecting the probe contact with the first contact portion. Each ball extends through a respective hole in the sheet. Each ball is also in contact with a respective first contact portion of a respective electrical line.