| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and a method for effectively collecting and reusing a used slurry. SOLUTION: The diameter of a polishing table 11 in a CMP (chemical- mechanical polishing) device 10 is set to be smaller than the diameter of a disc-shaped abrasive cloth 12 attached so as to cover the whole of the upper surface of the polishing table 11, and a space 13 is formed between an outer peripheral surface of the polishing table 11 and an outer peripheral lower part of the abrasive cloth 12. A ring-shaped trough 14 as a collecting device, which has an upper end opening portion 14a, is disposed in the space 13 along the outer peripheral surface of the polishing table 11, in such a way as to partially face to the abrasive cloth 12.</p> |
