发明名称 Method and apparatus for handling and testing wafers
摘要 Disclosed is a wafer handling and testing apparatus. The wafer handling and testing apparatus includes a support assembly, a wafer handling assembly, and a probe assembly. The support assembly is capable of supporting a wafer to be tested and is also capable of rotating the wafer for testing. The wafer handling assembly is arranged to move the wafer to and from the support assembly. The wafer handling assembly is capable of moving the along a first axis and a second axis. The first axis is preferably orthogonal to the second axis. The wafer probe is arranged to test the wafer when the wafer is placed on the support assembly.
申请公布号 US6249342(B1) 申请公布日期 2001.06.19
申请号 US19990347956 申请日期 1999.07.06
申请人 CHENG DAVID 发明人 CHENG DAVID
分类号 G01R31/28;H01L21/677;(IPC1-7):G01N21/00 主分类号 G01R31/28
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