发明名称 |
Method and structure for a semiconductor fuse |
摘要 |
A semiconductor fuse structure having a conductive fuse material abutting a first and second conductive line is provided. The fuse of the present invention does not substantially damage the surrounding semiconductor material therefore it can be used with a wide variety of materials including porous, mechanically fragile, low dielectric constant materials and high conductive metals like Cu. Methods of fabricating such a semiconductor fuse structure are also provided herein.
|
申请公布号 |
US6249038(B1) |
申请公布日期 |
2001.06.19 |
申请号 |
US19990326437 |
申请日期 |
1999.06.04 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
DAUBENSPECK TIMOTHY HARRISON;MOTSIFF WILLIAM THOMAS;RANKIN JED HICKORY |
分类号 |
H01L23/525;(IPC1-7):H01L29/00 |
主分类号 |
H01L23/525 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|