发明名称 Method and structure for a semiconductor fuse
摘要 A semiconductor fuse structure having a conductive fuse material abutting a first and second conductive line is provided. The fuse of the present invention does not substantially damage the surrounding semiconductor material therefore it can be used with a wide variety of materials including porous, mechanically fragile, low dielectric constant materials and high conductive metals like Cu. Methods of fabricating such a semiconductor fuse structure are also provided herein.
申请公布号 US6249038(B1) 申请公布日期 2001.06.19
申请号 US19990326437 申请日期 1999.06.04
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 DAUBENSPECK TIMOTHY HARRISON;MOTSIFF WILLIAM THOMAS;RANKIN JED HICKORY
分类号 H01L23/525;(IPC1-7):H01L29/00 主分类号 H01L23/525
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