发明名称 THREE-DIMENSIONAL STRUCTURE AND METHOD FOR MANUFACTURE THEREOF
摘要 <p>PURPOSE: To make the subject structure available suitably as a multi-layer wiring board or a stereoscopic wiring board which has a high degree of freedom in a circuit design and which consists of minute wiring, by providing parts arrayed in the periodical range of a specified value so that a photonic band is formed in a plurality of areas filled with substances. CONSTITUTION: A three-dimensional structure is such that it is equipped with a porous body having three-dimensionally continuous through-holes and with plural areas formed in the porous body and filled with substances, and that the plural areas filled with the substances have parts arrayed in a period of average 0.1-2μm so that a photonic band is formed. The substances to be filled in the periodically arranged areas are various polymers, ceramic materials such as metal oxides and metal or the like and; they are not specified and may be liquid crystals or non-linear optical materials. The parts other than the periodically arranged areas may be left porous with voids as they are or filled with other substances such as light modulation materials like liquid crystals and laser emitting materials.</p>
申请公布号 KR20010050467(A) 申请公布日期 2001.06.15
申请号 KR20000054153 申请日期 2000.09.15
申请人 KABUSHIKI KAISHA TOSHIBA 发明人 ASAKAWA KOUJI;HIRAOKA TOSHIRO;HOTTA YASUYUKI
分类号 H01B1/20;G02B6/122;H05K3/18;H05K3/42;H05K3/46;(IPC1-7):H01B1/20 主分类号 H01B1/20
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