| 摘要 |
The invention relates to a method for interconnecting at least two integrated circuit boards, wherein one printed circuit board has contacts (65, 66) on a rear surface and conductive feed-throughs (60) electronically linking the contacts (65,66) on the rear surface to a region of the integrated circuit (51) on the front surface, the rear surface contacts being welded or glued to the front surface contacts (64) of another silicon wafer. The invention also relates to a method for the production of said conductive feed-throughs, comprising the following steps: troughs (50) having a given depth are made on the front surface of a silicon wafer; an electrically insulating material (61) is deposited on the walls of said troughs; at least one electrically conductive material (62,63) is deposited on the insulated walls of the troughs, and the silicon circuit wafer (50) is thinned down by chemical and/or mechanical abrasion of the rear surface thereof until the conductive material (62,63) deposited in the troughs is reached. |
