发明名称 METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PURPOSE: To provide a method and an apparatus for manufacturing a semiconductor device which comprises a process of manufacturing a silicon nitride film, allows the maintenance frequency to be possibly lessened, and can suppress or prevent the growth of particles. CONSTITUTION: A step of forming a silicon nitride film on a semiconductor wafer disposed in a quartz reaction chamber by the thermal CVD method with bis-tertiary butylaminosilane and NH3 flowing as raw material gases in the quartz reaction chamber is repeated at a specified number of times, then NF3 gas is flowed in the reaction chamber to remove silicon nitrogen formed in the reaction chamber, and again a step of forming a silicon nitride film on a semiconductor wafer disposed in a quartz reaction chamber by the thermal CVD method with bis-tertiary butylaminosilane and NH3 flowing as raw material gases in the quartz reaction chamber is repeated at a specified number of times.
申请公布号 KR20010050379(A) 申请公布日期 2001.06.15
申请号 KR20000053113 申请日期 2000.09.07
申请人 HITACHI KOKUSAI ELECTRIC INC. 发明人 MAEDA KIYOHIKO;MIZUNO NORIKAZU
分类号 H01L21/314;C23C16/34;C23C16/44;H01L21/311;H01L21/318;(IPC1-7):H01L21/314 主分类号 H01L21/314
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