发明名称 |
METHOD AND APPARATUS FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PURPOSE: To provide a method and an apparatus for manufacturing a semiconductor device which comprises a process of manufacturing a silicon nitride film, allows the maintenance frequency to be possibly lessened, and can suppress or prevent the growth of particles. CONSTITUTION: A step of forming a silicon nitride film on a semiconductor wafer disposed in a quartz reaction chamber by the thermal CVD method with bis-tertiary butylaminosilane and NH3 flowing as raw material gases in the quartz reaction chamber is repeated at a specified number of times, then NF3 gas is flowed in the reaction chamber to remove silicon nitrogen formed in the reaction chamber, and again a step of forming a silicon nitride film on a semiconductor wafer disposed in a quartz reaction chamber by the thermal CVD method with bis-tertiary butylaminosilane and NH3 flowing as raw material gases in the quartz reaction chamber is repeated at a specified number of times.
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申请公布号 |
KR20010050379(A) |
申请公布日期 |
2001.06.15 |
申请号 |
KR20000053113 |
申请日期 |
2000.09.07 |
申请人 |
HITACHI KOKUSAI ELECTRIC INC. |
发明人 |
MAEDA KIYOHIKO;MIZUNO NORIKAZU |
分类号 |
H01L21/314;C23C16/34;C23C16/44;H01L21/311;H01L21/318;(IPC1-7):H01L21/314 |
主分类号 |
H01L21/314 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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