发明名称 ADVANCED MODULAR CELL PLACEMENT SYSTEM
摘要 A system for determining an affinity associated with relocating a cell located on a surface of a semiconductor chip to a different location on the surface is disclosed herein. Each cell may be part of a cell net containing multiple cells. The system initially defines a bounding box containing all cells in the net which contains the cell. The system then establishes a penalty vector based on the bounding box and borders of a region containing the cell, computes a normalized sum of penalties for all nets having the cell as a member, and calculates the affinity based on the normalized sum of penalties. Also included in the disclosed system are methods and apparatus for capacity and utilization planning of the use of the floor, or the surface area, and the methods and apparatus for parallelizing the process of affinity based placements using multiple processors. Finally, method and apparatus for connecting the cells based on a Steiner Tree method is disclosed.
申请公布号 US2001003843(A1) 申请公布日期 2001.06.14
申请号 US19990444975 申请日期 1999.11.22
申请人 SCEPANOVIC RANKO;PAVISIC IVAN;KOFORD JAMES S;ANDREEV ALEXANDER E;JONES EDWIN 发明人 SCEPANOVIC RANKO;PAVISIC IVAN;KOFORD JAMES S;ANDREEV ALEXANDER E;JONES EDWIN
分类号 G06F17/50;(IPC1-7):G06F17/50 主分类号 G06F17/50
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