发明名称 |
Radiotaajuusmoduuli |
摘要 |
An RF module includes a multi-layered substrate. A base-band IC, a memory IC, a quartz oscillator and surface-mount components are mounted on the upper surface of the multi-layered substrate. A metallic cap also is attached to the upper surface of the multi-layered substrate. A cavity is formed in the lower surface of the multi-layered substrate substantially at the center thereof. A first RF-IC and a second RF-IC are embedded in the cavity. Wiring patterns for providing connections between the base-band IC and the memory IC, through-holes, RF passive components, and the shield ground electrode pattern are disposed inside of the multi-layered substrate. |
申请公布号 |
FI20011247(A0) |
申请公布日期 |
2001.06.13 |
申请号 |
FI20010001247 |
申请日期 |
2001.06.13 |
申请人 |
MURATA MANUFACTURING CO., LTD, |
发明人 |
OIDA,TOSHIFUMI;WATANABE,TAKAHIRO;INA,EIGORO;NAKAJIMA,NORIO |
分类号 |
H05K3/46;H01L23/02;H01L23/12;H01L23/552;H01L23/66;H01L25/04;H01L25/18;H01Q1/24;H01Q1/38;H01Q21/00;H01Q23/00;H04B1/38;H05K1/16;(IPC1-7):H01L |
主分类号 |
H05K3/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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