| 摘要 |
PROBLEM TO BE SOLVED: To provide a treating device which can transfer an object to be treated between a resist coater/developer and an exposing device while destaticizing the object. SOLUTION: Electric charges stored in a wafer W to be treated are led out by grounding a transport arm 4 for delivery which comes into contact with the wafer W when the wafer W is transported between the resist coater/ developer 61 and EB aligner 62, the wafer supporting pins 8 of a wafer delivery stage 2, and the leading-out pin 17 of a wafer cassette 6 for buffer through grounding conductors 16. Since resistors 7 having resistance values of about 10 MΩare provided in the courses of the conductors 16 of the pins 8 and 17, respectively, the flow of excessively large currents and, accordingly, the occurrence of sparks can be prevented when the wafer W and the wafer cassette 6 come into contact with the pins 8 and 17, respectively. |
