发明名称 MULTILAYER FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To provide a high reliability flexible printed circuit board. SOLUTION: A plurality of junctions 15A1 to 15A3, 15B1 to 15B3, 35A1 to 35A3, 35B1 to 35B3 are provided in connecting areas 28A, 28B, 48A, 48B to which flexible printed circuit board strips 10, 30 are electrically connected and are connected via bumps provided in the junctions 15A1 to 15A3 of the one side flexible printed circuit board strip 10. When at least one of the bumps is connected, electrical connection is secured between the connecting areas 28A and 48A (or between the connecting areas 28B and 48B). As a result, a yield and reliability are improved.
申请公布号 JP2001160600(A) 申请公布日期 2001.06.12
申请号 JP19990342699 申请日期 1999.12.02
申请人 SONY CHEM CORP 发明人 KURITA HIDEYUKI;HISHINUMA HIROYUKI;ANZAI YUKIO;KISHIMOTO SOICHIRO
分类号 H05K3/46;H01L23/12;H05K1/14;(IPC1-7):H01L23/12 主分类号 H05K3/46
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