| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact and light chip type semiconductor device for reducing the capacity of a sealing body without deteriorating producing efficiency, and to prevent the deterioration of adhesivity between the sealing body and the electrode by suppressing moisture absorption from the sealing body. SOLUTION: At least one part of the side face of a sealing body formed of sealing resin is allowed to constitute the same plane as the side face of a chip substrate at which any terminal part is not formed, and the area of the side face of the sealing body constituting the same place face as the side face of the chip substrate is set so as to be ranging from 10 to 50% of the maximum vertical cross-sectional area of the sealing body. At that time, it is desired that the whole side face of the sealing body is allowed to constitute the same place as the side face of the chip substrate from the point of view that the sealing resin is smoothly force-fitted into a cavity. |
