| 摘要 |
PROBLEM TO BE SOLVED: To obtain a method for molding a resin having a light-emitting diode so as to make it hard to apply temperature deterioration to a semiconductor part. SOLUTION: A method for molding a resin having a light-emitting diode has a stage, which performs a stage for passing the lead wire 102L of a light- emitting diode 102 through the hole 202e of a fixed mold 202 having two holes, a stage for inserting an insertion member 260, which has a contact part 206d provided so as to be brought into contact with the light emitting part 102c of the light-emitting diode 102 or the light emitting part 102c and body part 102a thereof, in the hole 2040 of a movable mold 204, and subsequently moves the movable mold 204 not only to bring the fixed mold 202 and the movable mold 204 to a contact state in mutually opposed relationship but also to form an injection space 300 between the fixed mold 202 and the movable mold 204 and allows a thermoplastic resin 320 to flow in the injection space 300, and a stage for allowing a fluid 400 to flow in the insertion member. |
