| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor process evaluating device that can accurately evaluate a device with desired current density. SOLUTION: In the semiconductor process evaluating device for carrying out a conduction test by applying a probe needle on a wafer, a heat sink is formed in the probe needle, in partially scraped so that the tip of the probe needle can be viewed from an upper surface, is set to a radial shape, and at the same time is composed by one or a plurality of metal materials or materials with an excellent heat radiation property.
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