| 发明名称 |
Apparatus and methods for chemical-mechanical polishing of semiconductor wafers |
| 摘要 |
An apparatus and method for polishing the surface of a semiconductor wafer is provided in which the polishing pad has on its surface a multiplicity of nanoasperities which are particles having an imputed radius (of curvature) of about 0.5 to about 0.1 microns and sufficient resiliency to permanently deform by less than 10% which contact the wafer surface in combination with a reactive liquid solution.
|
| 申请公布号 |
US6245679(B1) |
申请公布日期 |
2001.06.12 |
| 申请号 |
US20000498267 |
申请日期 |
2000.02.03 |
| 申请人 |
RODEL HOLDINGS, INC |
发明人 |
COOK LEE MELBOURNE;JAMES DAVID B.;BUDINGER WILLIAM D.;ROBERTS JOHN V. H.;OLIVER MICHAEL R.;CHECHIK NINA G.;LEVERING, JR. RICHARD M. |
| 分类号 |
B24B37/04;B24B41/047;B24B57/02;B24D3/28;B24D3/34;B24D13/10;B24D13/14;G11B23/00;H01L21/306;(IPC1-7):H01L21/00 |
主分类号 |
B24B37/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
