发明名称 |
Method of fabricating dielectric layer |
摘要 |
A method of fabricating a dielectric layer is provided. A first oxide layer is formed on a polysilicon layer. A silicon-rich nitride layer is formed on a first oxide layer. A silicon-poor nitride layer is formed on the silicon-rich nitride layer. An oxidation step is performed on the silicon-poor nitride layer. A second oxide layer is formed on the silicon-poor nitride layer. The dielectric layer comprising a multiple nitride layer structure is formed.
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申请公布号 |
US6245617(B1) |
申请公布日期 |
2001.06.12 |
申请号 |
US19990306253 |
申请日期 |
1999.05.06 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
YANG YI-CHANG;YU TANG |
分类号 |
H01L21/314;H01L21/318;H01L21/321;H01L21/8242;(IPC1-7):H01L21/336;H01L21/823;H01L21/31;H01L21/469 |
主分类号 |
H01L21/314 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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