发明名称 Method of fabricating dielectric layer
摘要 A method of fabricating a dielectric layer is provided. A first oxide layer is formed on a polysilicon layer. A silicon-rich nitride layer is formed on a first oxide layer. A silicon-poor nitride layer is formed on the silicon-rich nitride layer. An oxidation step is performed on the silicon-poor nitride layer. A second oxide layer is formed on the silicon-poor nitride layer. The dielectric layer comprising a multiple nitride layer structure is formed.
申请公布号 US6245617(B1) 申请公布日期 2001.06.12
申请号 US19990306253 申请日期 1999.05.06
申请人 UNITED MICROELECTRONICS CORP. 发明人 YANG YI-CHANG;YU TANG
分类号 H01L21/314;H01L21/318;H01L21/321;H01L21/8242;(IPC1-7):H01L21/336;H01L21/823;H01L21/31;H01L21/469 主分类号 H01L21/314
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