| 摘要 |
PROBLEM TO BE SOLVED: To improve reliability of airtightness, and to cause an electronic component which is to be housed in a package to operate normally over a long term. SOLUTION: This package for housing an electronic component is constituted of an insulating substrate 1, having a loading part 1 on whose face an electronic component 3 is loaded and each sealing part 8 warped in a protruding shape to which a rectangular metallized layer 5 for sealing is adhered so that the loading part 1a can be surrounded and a metallic cover body 2 connected via brazing materials 6 with the metallized layer 5 for sealing of the sealing part 8 through electron beam welding. In this case, since each side of the sealing part 8 is curved into a projecting shape in the longitudinal direction, at electron beam welding of the metallic cover body 2 with the metallized layer 5 for sealing, the four corners of the metallic cover body 2 are pressurized to the metallized layer 5 for sealing, so that the metallic cover body 2 can be adhered satisfactorily to the metallized layer 5 for sealing with no gaps. |
