ADDITIONAL REINFORCING STRUCTURE OF IC PACKAGE AND METHOD THEREFOR

摘要

PROBLEM TO BE SOLVED: To improve reliability for reinforcing IC package and enable to perform maintenance of the IC package after resin sealing. SOLUTION: An additional reinforcing structure 1 of an IC package is mounted on a mother board 2 and sealed at a portion thereof by a resin for reinforcing the package. A box-type reinforcing member 4 with a lid covers the IC package 3 and comprises a side 4a and a lid 4b into which the package reinforcing resin 5 can be injected is mounted on the mother board 2a. The additional reinforcing member 4 has a through hole 12 passing through the lid 4b and a notch 10 passing through the side 4a, and has an opening in its periphery of two resin inlets 10, 12 free from overlapping each other in a linear direction on the same plane.