| 摘要 |
PROBLEM TO BE SOLVED: To provide height measuring method and device capable of setting the reference surface as a reference for measuring the height with high accuracy, simplifying the height measurement for a bump and effecting the height measurement with high accuracy. SOLUTION: A laser beam is scanned in two dimensions and applied to the surface of a wafer 3, reflected lights from the bump 2 and the wafer 3 are detected by a light position detecting part 5, a height measurement value of each measuring point is obtained from quantity if received reflected light. A three-dimensional shape diagram corresponding to the measurement values is generated, dispersion of height measurement values of each measuring point in a measurement reference area specified on the three-dimensional shape diagram is determined. When dispersion is a preset dispersion threshold or less, it is adopted as a measurement reference surface, and according to the reference height on the measurement reference surface, the height of the bump 2 is obtained.
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