| 摘要 |
<p>PROBLEM TO BE SOLVED: To achieve high-density mounting by reducing the installation area of a resistance element. SOLUTION: Resistor paste 9 is buried into an interlayer insulation film 22, and the resistor paste 9, a conductor part 61 of a first conductor layer, and a conductor part 62 of a second conductor layer are brought into contact with the resistor paste 9, thus composing a resistance element with a part in contact with the conductor part as an electrode.</p> |
