| 摘要 |
PROBLEM TO BE SOLVED: To generally provide a method and an apparatus for releasing polishing material in a polishing device. SOLUTION: In one embodiment, this apparatus includes a platen having one or more nozzles coupled thereto. The platen has a support surface adapted to support the polishing material. The nozzles are adapted to make a fluid flow therethrough, that places the polishing material in a spaced-apart relation to the platen. One or more nozzles further include a centerline that forms an acute angle with the support surface. In another embodiment, the method includes the steps of supporting at least a portion of the polishing material on the platen, supplying a fluid between the polishing materials, and lifting the polishing material to a spaced-apart relation to the platen. |
