| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate for testing which can surely prevent a pattern for testing from being cracked when a leadless package is tested. SOLUTION: Patterns for testing 12a, 13a and 12b, 13b are formed in a direction orthogonal to the arrangement direction of a plurality of leads at the leadless package 20, whereas the leading end parts of patterns for testing 11a, 14a, 11b and 14b to be electrically connected to leads 21a, 24a, 21b and 24b set at four corners of the package 20 are formed in a direction parallel to the lead arrangement direction. In the arrangement, since only a part of a curving pressure by pressuring from the package 20 acts to the patterns 11a, 14a, 11b and 14b when the package is tested, the patterns are prevented from being cracked. Even when the pressure acts in a state of this level at an electric contact time, conduction of the package can be checked with a sufficient accuracy.
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