| 摘要 |
PROBLEM TO BE SOLVED: To provide inexpensive heat treatment equipment for a semiconductor wafer, in which the occurrence of slip can be prevented by improving the in- plane soaking property of a semiconductor wafer, and t the same time, the sizes of lamp heating sources can be reduced. SOLUTION: This heat treatment equipment for a semiconductor wafer has lamp heating sources 3 and 4, respectively arranged above and below a semiconductor wafer W and a heater heating source 5 which surrounds the wafer W separated a distance.
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