| 摘要 |
PROBLEM TO BE SOLVED: To provide a photosensitive resin composition excellent in adhesion, stripping characteristic and scumming property, a photosensitive element excellent in adhesion, stripping characteristic, scumming property and chemical resistance and in the mechanical characteristics, handleability and work efficiency of a photo-cured body, a method for producing a resist pattern and a method for producing a printed wiring board. SOLUTION: The photosensitive resin composition contains (A) a binder polymer, (B) a photopolymerizable compound having at least one polymerizable ethylenically unsaturated bond in one molecule and (C) a photopolymerization initiator. The component B includes (b-1) a bisphenol A type (meth)acrylate compound and (b-2) a compound of formula I (where R1 is H or methyl; X1 is a 2-6C alkylene; and (m) is an integer of 4-20) as essential components. The photosensitive resin composition is applied, dried and laminated on a substrate to obtain the objective photosensitive element. |
