Semiconductor package for DIMM (dual in-line memory module), has length larger than body width and smaller than total package width

摘要

The semiconductor package (40) is square shaped i.e. the length (L) is larger than the body width (W1) and smaller than the total width (W2) of the package including the exposed lead portions. The package has semiconductor chip which has multiple bonding contacts arranged on upper side, along the length of the package. The leads (48) are extended over the upper side of the chip and are connected electrically with the bonding contacts.