摘要 |
A chip mounter for mounting a chip on a substrate comprises a head (1) having a function of holding the chip and pressing and bonding the chip to the substrate by moving along the Z axis among the mutually orthogonal X, Y and Z axes, and a stage (2) having a function of holding the substrate, drivable in at least one of the directions along the X and Y axes, driven in one direction out of the drivable directions so as to mount the chip in a predetermined position on the substrate, and finely adjusted for alignment. The required rigidity of the frame of the head (1) is lessened, the weight of the head (1) is reduced, restrictions, e.g. increase of inertia due to increase in the weight of the head (1) are eliminated, and vibration of the stage (2) is prevented during movement. Therefore the chip can be mounted accurately in a specified position at high speed.
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