发明名称 |
POLY(PHENYLENE ETHER) - POLYVINYL THERMOSETTING RESIN |
摘要 |
<p>A capped poly(phenylene ether) resin composition is formed from (1) a poly(phenylene ether) compound (PPE) in which at least a portion, preferably substantially all of the hydroxyl groups have been reacted with a compound containing ethylenic unsaturation (carbon-carbon double bonds) which is further reactive with unsaturated monomers (reactively endcapped PPE) and (2) a curable unsaturated monomer composition. The composition optionally contains a polymerization catalyst; a flame-retardant compound; and fibrous reinforcement. The composition can be cured to form a laminate, and clad with copper to form a circuit board.</p> |
申请公布号 |
WO0140354(A1) |
申请公布日期 |
2001.06.07 |
申请号 |
WO2000US31133 |
申请日期 |
2000.11.14 |
申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
YEAGER, GARY, WILLIAM;COLBORN, ROBERT, EDGAR |
分类号 |
C08J5/24;B32B27/00;C08F290/06;C08G65/48;C08K5/00;C08K7/02;C08L71/12;H01L23/14;H05K1/03;(IPC1-7):C08G65/48 |
主分类号 |
C08J5/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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