A soldering flux includes a non-acidic resin in an aqueous composition. The flux can also include an activating agent and a surface-active agent that promotes surface wetting. The flux can be used to coat circuits and a printe d circuit board.
申请公布号
CA2393399(A1)
申请公布日期
2001.06.07
申请号
CA20002393399
申请日期
2000.12.01
申请人
FRY'S METALS, INC. D.B.A. ALPHA METALS, INC.
发明人
ARORA, SANYOGITA;TELLEFSEN, KAREN A.;SCHNEIDER, ALVIN F.
