发明名称 Wafer scrubbing brush core
摘要 A brush core and the method for making a brush core for use in substrate scrubbing are provided. The substrate can be any substrate that may need to undergo a scrubbing operation to complete a cleaning operation, etching operation, or other preparation. For instance, the substrate can be a semiconductor wafer, a disk, or any other type of work piece that will benefit from a brush core that can deliver uniform controlled amounts of fluid through the brush along an entire length of the brush core. The brush core is defined by a tubular core having a length that extends between a first end and a second end. The first end has an opening into a bore that is defined through a middle of the tubular core and extends along an inner length of the tubular core. A first plurality of holes are oriented along a plurality of first lines that extend in the direction of the length of the tubular core, and each of the first plurality of holes define paths to the bore of the tubular core. A second plurality of holes are oriented along a plurality of second lines that extend in the direction of the length of the tubular core, and each of the second plurality of holes define paths to the core of the tubular core. The plurality of first lines and the plurality of second lines alternate and the holes of the first and second plurality of holes are equally spaced apart. The holes of the second plurality of holes are offset relative to the holes of the first plurality of holes.
申请公布号 US6240588(B1) 申请公布日期 2001.06.05
申请号 US19990454698 申请日期 1999.12.03
申请人 LAM RESEARCH CORPORATION 发明人 DICKEY TANLIN;SVIRCHEVSKI JULIA S.;ANDERSON DONALD E.;RAVKIN MIKE;TREICHEL HELMUTH W.;PASCAL ROY WINSTON;GARDNER DOUGLAS S.
分类号 A46B7/10;A46B11/02;A46B13/02;H01L21/00;H01L21/304;(IPC1-7):B05C1/08 主分类号 A46B7/10
代理机构 代理人
主权项
地址