| 发明名称 |
SEMICONDUCTOR PACKAGE |
| 摘要 |
<p>PURPOSE: A semiconductor package is provided to reduce the package in size and easily radiate heat generated in a semiconductor chip, by exposing a part of the semiconductor chip and a lead to the exterior. CONSTITUTION: A lead(12) of a lead frame is vertically bent. A semiconductor chip(14) is adhered to a lower surface of an upper portion of the lead by an adhesive unit(18). A wire(16) is connected between the lead and a bonding pad of the semiconductor chip. Molding resin(20) is formed wherein a part of the lead and the lower surface of the semiconductor chip are exposed to the exterior.</p> |
| 申请公布号 |
KR20010045638(A) |
申请公布日期 |
2001.06.05 |
| 申请号 |
KR19990048981 |
申请日期 |
1999.11.05 |
| 申请人 |
AMKOR TECHNOLOGY KOREA, INC. |
发明人 |
HAN, IM TAEK;LEE, GIL JIN |
| 分类号 |
H01L23/04;(IPC1-7):H01L23/04 |
主分类号 |
H01L23/04 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
|
| 地址 |
|
