Centralized cooling interconnect for electronic packages

摘要

An apparatus for centralizing heat dissipation on printed circuit boards is disclosed. The printed circuit board materials are used to thermally conduct heat from a circuit that generates heat to a heat sink. The heat sink can be the layer on the printed circuit board, conductive paths on a layer of a printed circuit board, or the layers of the printed circuit board can be used to thermally couple the heat generating circuit to an external, remote heat sink for heat dissipative purposes.