发明名称 SOLDERING FLUX
摘要 PROBLEM TO BE SOLVED: To provide a flux and solder paste having high preservable stability as well as a soldering method and solder which deal with finer pitches and diversification of parts and have high reliability. SOLUTION: Specific ascorbic acid derivatives, specific tocopherol derivatives and lecithin are added as reducing agents into the flux. The particles below 20μm in the solder powder is confined to <=30% in number distribution, the oxygen content therein to <=500 ppm and the moisture content in the solder paste to <=0.5 wt.%.
申请公布号 JP2001150183(A) 申请公布日期 2001.06.05
申请号 JP19990343361 申请日期 1999.12.02
申请人 SHOWA DENKO KK 发明人 AMITA HITOSHI;MURASE NORIKO;SHOJI TAKASHI
分类号 B23K35/363;H05K3/34;(IPC1-7):B23K35/363 主分类号 B23K35/363
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