发明名称 GRINDING METHOD AND GRINDING DEVICE
摘要 PROBLEM TO BE SOLVED: To uniformly grinding-processing a whole surface of a disc at a high grinding accuracy. SOLUTION: A rotation shaft provided with a grinding tool 15 and a rotation shaft provided with a grinding tool 16 are rotated making a rotation center OG as a center. A disc W having a through hole H is supported and rotated by guide rollers 17, 18 contacted with an inner periphery Sa of the through hole H. A rotation center OW is deviated from the rotation center OG of the grinding tools 15, 16 by an eccentric amount E. The respective grinding tools 15, 16 have ring-like grinding surface 19 having a smaller outer diameter than that of the disc W and a larger inner diameter than that of the through hole H. The grinding surface 19 contacts the disc W so as to lay the through hole H and a slide movement direction of the grinding surface 19 becomes a direction approximated to a surface movement direction of the disc W accompanying with rotation.
申请公布号 JP2001150309(A) 申请公布日期 2001.06.05
申请号 JP19990330507 申请日期 1999.11.19
申请人 SYSTEMSEIKO CO LTD 发明人 OKUYAMA SHINICHI
分类号 B24B7/17;B24B37/08;G11B23/50 主分类号 B24B7/17
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