DEVICE FOR MEASURING INPROCESS AT SURFACE CUTTING

摘要

PURPOSE: A measuring method of an inprocess at a surface cutting is provided to decide the moving amount of a fine cutting tool by using a predicting model. CONSTITUTION: A spindle(4) rotates a processed material(1). A fine cutting tool(2) process the processed material. A position sensor(3) measures processing errors of the processed material. A moving bar(5) changes the positions of the fine cutting tool and the position sensor. A low band filter(6) processes measured data from the position sensor. A data collector(7) collects data processed in the low band filter. A predicting model(9) predicts processing errors of the processed material. An amplifier(8) amplifies voltages from the predicting model. Thereby, the moving amount of the fine cut tool is decided by predicting. Therefore, a fine mirror like finishing is performed.