| 摘要 |
Resin is moulded to seal electronic parts mounted on lead frames (14) using a moulding unit (5) having a mould (26,28) with resin supply pots (29) arranged in it, resin pressurising plungers being provided on the pots, cavities in surfaces of the mould, and resin passages between the cavities and the pots. The number of moulding units is adjusted by detachably mounting an additional moulding unit (5a,5b,5c) with respect to the unit already provided, supplying unsealed lead frames (14) with electronic parts mounted on them and resin tablets (21) into each moulding unit, moulding the resin to seal the parts using the units, and taking out the sealed parts from each unit to the exterior. Also claimed is appts. for moulding resin to seal electronic parts using the method including means for taking out the sealed parts from the moulding unit to the exterior, the additional units being detachably mountable with respect to the already provided moulding unit to enable their number to be freely increased or decreased. |
