Procedure for lettering of semiconducting disk by means of laser has position and depth determined by difference in distance between measuring laser, surface of semiconducting disk and base of laser marking

摘要

A procedure for the lettering of a semiconducting disk by means of a laser has the position and depth of the laser point during the marking process measured by determining the difference in distance between a measuring laser, the surface of the semiconducting disk and the base of the laser marking. The measurement parameter thus obtained is used for the adjustment of the laser marking. The laser used for the manufacture of the laser point is used as a measurement laser. As a measurement laser, an additional laser is also used. The reflecting material is evaluated by a spectrometer. For the evaluation, the silicon band is used.