发明名称 THICK FILM RESISTOR AND ITS MANUFACTURING METHOD
摘要 <p>PROBLEM TO BE SOLVED: To exclude bleeding of resistor printing by flattening a resistor printed surface. SOLUTION: This thick film resistor like a chip resistor consists of a substrate, an insulating layer 8 formed on the substrate, a conductor 3 formed flush on the insulating layer 8 without step-difference from the insulating layer 8 practically, and a resistance layer 4 formed on the conductor 3. The conductor 3 is constituted by using material having a softening point and a specific gravity which are higher than those of material which so constitutes the insulating layer 8 that the conductor 3 is sunk into the insulating layer 8 which is soften when baking.</p>
申请公布号 JP2001148301(A) 申请公布日期 2001.05.29
申请号 JP19990330146 申请日期 1999.11.19
申请人 ROHM CO LTD 发明人 HANAMURA TOSHIHIRO
分类号 H01C17/06;H01C7/00;(IPC1-7):H01C7/00 主分类号 H01C17/06
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