发明名称 SEMICONDUCTOR DEVICE TRIMMING CIRCUIT STRUCTURE
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device trimming circuit structure, which enables Zener breakdown to occur easily between the anode and cathode of a Zener diode with a small set current, without using a large current source such as a power transistor or the like. SOLUTION: In a trimming circuit structure of a semiconductor device, composed of a Zener diode Z connected in parallel with trimming resistors R1 and R2, a capacitor C is connected between the anode and cathode of the Zener diode Z so as to be connected in parallel with the Zener diode Z.
申请公布号 JP2001148459(A) 申请公布日期 2001.05.29
申请号 JP19990331470 申请日期 1999.11.22
申请人 SONY CORP 发明人 MORI HIDEKI
分类号 H01L27/04;H01L21/822;(IPC1-7):H01L27/04 主分类号 H01L27/04
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