| 摘要 |
A method for manufacturing multi-layered wiring board in which the positions of alignment marks are detected by irradiating a base material with X rays, and the position of the base material is corrected in accordance with the detected positions of the alignment marks. Then, the aligned base material is successively laminated upon another so as to improve the lamination accuracy. In the method, in addition, such a constitution is adopted that, when the laminating process is repeated twice or more, the position of each base material is corrected by offsetting the base material from the laminating position and the base material is laminated upon another base material at the laminating position by backing the base material to the laminating position. Namely, the positional displacement between the base materials to be laminated upon another is corrected by deciding the position of each base material against the preset optical axis of X rays. When such a constitution is adopted, a plurality of base materials can be laminated upon another with accuracy.
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